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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | II | - |
| dc.citation.conferencePlace | World Trade CenterBangalore | - |
| dc.citation.endPage | 16 | - |
| dc.citation.startPage | 13 | - |
| dc.citation.title | IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2014) | - |
| dc.contributor.author | Han, Ki Jin | - |
| dc.contributor.author | Swaminathan, M | - |
| dc.date.accessioned | 2023-12-19T23:06:35Z | - |
| dc.date.available | 2023-12-19T23:06:35Z | - |
| dc.date.created | 2015-07-01 | - |
| dc.date.issued | 2014-12-15 | - |
| dc.description.abstract | For the efficiency improvement of 3D path-finding methodology, this paper presents the reduction of computational cost in the calculation of capacitive coupling between planar and cylindrical structures. The previously used global adaptive quadrature for integrations involving the angular variable is replaced by a simple trapezoidal quadrature with the double-exponential transformation. Also, the other integrations over planar variables is approximated to a simple summation. From the verifications of the proposed technique for various coupling structures shows that the updated modeling method reduces the computation time by up to 12%. | - |
| dc.identifier.bibliographicCitation | IEEE Electrical Design of Advanced Packaging & Systems Symposium (EDAPS 2014), pp.13 - 16 | - |
| dc.identifier.doi | 10.1109/EDAPS.2014.7030803 | - |
| dc.identifier.scopusid | 2-s2.0-84936135693 | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/46673 | - |
| dc.identifier.url | https://ieeexplore.ieee.org/document/7030803 | - |
| dc.language | 영어 | - |
| dc.publisher | IEEE | - |
| dc.title | Efficient Computation of Capacitive Coupling Between Planar and Cylindrical Interconnections | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2014-12-14 | - |
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