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정훈의

Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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CNC 가공과 복제 몰딩을 통한 건식 접착 패치 개발

Author(s)
황인솔이훈고한길박현하선가현성민호이상현정훈의
Issued Date
2016-12-16
URI
https://scholarworks.unist.ac.kr/handle/201301/40124
Citation
대한기계학회 2016년도 학술대회
Abstract
Bioinspired dry adhesives have been developed over the years as they have superior adhesion properties. Dry adhesives have superior adhesion strength, reversible adhesion, rough surface adaptation, self-cleaning, directional adhesion and so on. However, techniques of making dry adhesives in previous manufacturing based on lithographic approaches such as photolithography or e-beam lithography are very expensive, complicated, non-environment friendly process so they are inappropriate for applying to scalable and commercialized mass production. In my project, I’m going to present a new fabrication technique about development of dry adhesive patch using CNC machining and replica molding. It is simple, scalable and eco-friendly, and it can be applied to mass production also. Our suggested
fabrication technique will accelerate the wide-spread use and commercialization of biomimetic smart dry adhesives.
Publisher
대한기계학회

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