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정훈의

Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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dc.citation.conferencePlace KO -
dc.citation.title 대한기계학회 2016년도 학술대회 -
dc.contributor.author 황인솔 -
dc.contributor.author 이훈 -
dc.contributor.author 고한길 -
dc.contributor.author 박현하 -
dc.contributor.author 선가현 -
dc.contributor.author 성민호 -
dc.contributor.author 이상현 -
dc.contributor.author 정훈의 -
dc.date.accessioned 2023-12-19T19:37:11Z -
dc.date.available 2023-12-19T19:37:11Z -
dc.date.created 2017-01-09 -
dc.date.issued 2016-12-16 -
dc.description.abstract Bioinspired dry adhesives have been developed over the years as they have superior adhesion properties. Dry adhesives have superior adhesion strength, reversible adhesion, rough surface adaptation, self-cleaning, directional adhesion and so on. However, techniques of making dry adhesives in previous manufacturing based on lithographic approaches such as photolithography or e-beam lithography are very expensive, complicated, non-environment friendly process so they are inappropriate for applying to scalable and commercialized mass production. In my project, I’m going to present a new fabrication technique about development of dry adhesive patch using CNC machining and replica molding. It is simple, scalable and eco-friendly, and it can be applied to mass production also. Our suggested
fabrication technique will accelerate the wide-spread use and commercialization of biomimetic smart dry adhesives.
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dc.identifier.bibliographicCitation 대한기계학회 2016년도 학술대회 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/40124 -
dc.language 한국어 -
dc.publisher 대한기계학회 -
dc.title CNC 가공과 복제 몰딩을 통한 건식 접착 패치 개발 -
dc.type Conference Paper -
dc.date.conferenceDate 2016-12-14 -

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