In this study, the effect of thermal couducvitiy and thickness of substrate on the condensation heat transfer is investigated, in terms of the spreading thermal resistance. Copper, aluminum, stainless steel, glass and PET polymer is used as the test sample. Experimental setup is developed in the clean room to observe the condensation behavior. The results indicates that the condensation behavior deviate from the conventional prediction when the thermal conducvitiy is low and the substrate thickness is low. A scale analysis on the spreading thermal resistance is performed. The analysis results are shown to predict the experimental results qualitatively well.