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Byon, Chan
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DC Field Value Language
dc.citation.conferencePlace KO -
dc.citation.title Asian Conference on Thermal Sciences 2017 -
dc.contributor.author Kim, Yonghoon -
dc.contributor.author Byon, Chan -
dc.date.accessioned 2023-12-19T19:11:29Z -
dc.date.available 2023-12-19T19:11:29Z -
dc.date.created 2017-10-20 -
dc.date.issued 2017-03-28 -
dc.description.abstract In this study, the effect of thermal couducvitiy and thickness of substrate on the condensation heat transfer is investigated, in terms of the spreading thermal resistance. Copper, aluminum, stainless steel, glass and PET polymer is used as the test sample. Experimental setup is developed in the clean room to observe the condensation behavior. The results indicates that the condensation behavior deviate from the conventional prediction when the thermal conducvitiy is low and the substrate thickness is low. A scale analysis on the spreading thermal resistance is performed. The analysis results are shown to predict the experimental results qualitatively well. -
dc.identifier.bibliographicCitation Asian Conference on Thermal Sciences 2017 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/39407 -
dc.language 영어 -
dc.publisher Korean Society for Mechanical Engineers (KSME) -
dc.title Thermal conductivity and thickness effects on the condensation heat transfer -
dc.type Conference Paper -
dc.date.conferenceDate 2017-03-26 -

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