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Kim, Kyung Rok
Nano-Electronic Emerging Devices Lab.
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Novel design of multiple negative-differential resistance (NDR) device in a 32nm CMOS technology using TCAD

Author(s)
Sing, SunhaeKim, Kyung Rok
Issued Date
2013-09-03
DOI
10.1109/SISPAD.2013.6650638
URI
https://scholarworks.unist.ac.kr/handle/201301/35633
Fulltext
https://ieeexplore.ieee.org/document/6650638
Citation
18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013, pp.316 - 319
Abstract
We propose a novel multiple negative differential resistance (NDR) device with the positive inclined tri-state voltage transfer characteristics (VTC) between drain and gate of 32nm n-type MOSFET based on gate-induced drain leakage (GIDL) enhanced off-state CMOS ternary inverter. The ultrahigh 1st and 2nd peak-to-valley current ratio (PVCR) over 104 can be designed with high slope of inclined ternary VTC by increasing the GIDL effects.
Publisher
University of Glasgow
ISSN
1946-1569

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