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Kim, Kyung Rok
Nano-Electronic Emerging Devices Lab.
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dc.citation.conferencePlace UK -
dc.citation.conferencePlace Glasgow -
dc.citation.endPage 319 -
dc.citation.startPage 316 -
dc.citation.title 18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013 -
dc.contributor.author Sing, Sunhae -
dc.contributor.author Kim, Kyung Rok -
dc.date.accessioned 2023-12-20T00:39:26Z -
dc.date.available 2023-12-20T00:39:26Z -
dc.date.created 2013-11-04 -
dc.date.issued 2013-09-03 -
dc.description.abstract We propose a novel multiple negative differential resistance (NDR) device with the positive inclined tri-state voltage transfer characteristics (VTC) between drain and gate of 32nm n-type MOSFET based on gate-induced drain leakage (GIDL) enhanced off-state CMOS ternary inverter. The ultrahigh 1st and 2nd peak-to-valley current ratio (PVCR) over 104 can be designed with high slope of inclined ternary VTC by increasing the GIDL effects. -
dc.identifier.bibliographicCitation 18th International Conference on Simulation of Semiconductor Processes and Devices, SISPAD 2013, pp.316 - 319 -
dc.identifier.doi 10.1109/SISPAD.2013.6650638 -
dc.identifier.issn 1946-1569 -
dc.identifier.scopusid 2-s2.0-84891128387 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/35633 -
dc.identifier.url https://ieeexplore.ieee.org/document/6650638 -
dc.language 영어 -
dc.publisher University of Glasgow -
dc.title Novel design of multiple negative-differential resistance (NDR) device in a 32nm CMOS technology using TCAD -
dc.type Conference Paper -
dc.date.conferenceDate 2013-09-03 -

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