File Download

There are no files associated with this item.

  • Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
Related Researcher

김경록

Kim, Kyung Rok
Nano-Electronic Emerging Devices Lab.
Read More

Views & Downloads

Detailed Information

Cited time in webofscience Cited time in scopus
Metadata Downloads

LF Noise Analysis for Trap Recovery in Gate Oxides Using Built-In Joule Heater

Author(s)
Jeon, Chang-HoonKim, Choong-KiPark, Jun-YoungJeong, Ui-SikLee Byung-HyunKim, Kyung RokChoi, Yang-Kyu
Issued Date
2017-12
DOI
10.1109/TED.2017.2761770
URI
https://scholarworks.unist.ac.kr/handle/201301/22981
Fulltext
http://ieeexplore.ieee.org/document/8075164/
Citation
IEEE TRANSACTIONS ON ELECTRON DEVICES, v.64, no.12, pp.5081 - 5086
Abstract
The importance of the reliability of gate oxide materials is increasing continuously as CMOS technology advancing. Joule heating to induce localized high temperature via a built-in gate heater has recently been introduced as a rapid and efficient method to cure instances of gate oxide damage, including damaged interface traps and bulk traps in the gate oxide. In this paper, spatially distributed deep oxide traps were generated by Fowler-Nordheim (FN) stress, and a recovery process by electrothermal annealing (ETA) using local Joule heat was clearly demonstrated with low-frequency (LF) noise characteristics. The generation and recovery of the oxide traps were quantitatively analyzed with LF noise, and the results showed that the border traps generated by the FN stress were cured by ETA. The recovery process was predominantly affected by the applied gate voltage and the duration. Excessive gate voltage beyond the critical value permanently destroyed the gate oxide. The effect of a forming gas annealing (FGA) process on the gate oxide traps was also analyzed with LF noise and compared with that of ETA. Although electrical Joule heating was applied under a condition of ambient air, not hydrogen-rich atmosphere, the passivation effect was superior to that of a FGA process conducted in diluted H2 ambient.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
ISSN
0018-9383
Keyword (Author)
Electrothermal annealing (ETA)Fin Field-Effect Transistor (FinFET)gate oxide damagelocal Joule heatlow-frequency (LF) noisetrap recovery
Keyword
TRANSISTORS

qrcode

Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.