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Kim, Kyung Rok
Nano-Electronic Emerging Devices Lab.
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dc.citation.endPage 5086 -
dc.citation.number 12 -
dc.citation.startPage 5081 -
dc.citation.title IEEE TRANSACTIONS ON ELECTRON DEVICES -
dc.citation.volume 64 -
dc.contributor.author Jeon, Chang-Hoon -
dc.contributor.author Kim, Choong-Ki -
dc.contributor.author Park, Jun-Young -
dc.contributor.author Jeong, Ui-Sik -
dc.contributor.author Lee Byung-Hyun -
dc.contributor.author Kim, Kyung Rok -
dc.contributor.author Choi, Yang-Kyu -
dc.date.accessioned 2023-12-21T21:36:42Z -
dc.date.available 2023-12-21T21:36:42Z -
dc.date.created 2017-11-24 -
dc.date.issued 2017-12 -
dc.description.abstract The importance of the reliability of gate oxide materials is increasing continuously as CMOS technology advancing. Joule heating to induce localized high temperature via a built-in gate heater has recently been introduced as a rapid and efficient method to cure instances of gate oxide damage, including damaged interface traps and bulk traps in the gate oxide. In this paper, spatially distributed deep oxide traps were generated by Fowler-Nordheim (FN) stress, and a recovery process by electrothermal annealing (ETA) using local Joule heat was clearly demonstrated with low-frequency (LF) noise characteristics. The generation and recovery of the oxide traps were quantitatively analyzed with LF noise, and the results showed that the border traps generated by the FN stress were cured by ETA. The recovery process was predominantly affected by the applied gate voltage and the duration. Excessive gate voltage beyond the critical value permanently destroyed the gate oxide. The effect of a forming gas annealing (FGA) process on the gate oxide traps was also analyzed with LF noise and compared with that of ETA. Although electrical Joule heating was applied under a condition of ambient air, not hydrogen-rich atmosphere, the passivation effect was superior to that of a FGA process conducted in diluted H2 ambient. -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON ELECTRON DEVICES, v.64, no.12, pp.5081 - 5086 -
dc.identifier.doi 10.1109/TED.2017.2761770 -
dc.identifier.issn 0018-9383 -
dc.identifier.scopusid 2-s2.0-85032655788 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/22981 -
dc.identifier.url http://ieeexplore.ieee.org/document/8075164/ -
dc.identifier.wosid 000417727500038 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title LF Noise Analysis for Trap Recovery in Gate Oxides Using Built-In Joule Heater -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Electrical & Electronic; Physics, Applied -
dc.relation.journalResearchArea Engineering; Physics -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor Electrothermal annealing (ETA) -
dc.subject.keywordAuthor Fin Field-Effect Transistor (FinFET) -
dc.subject.keywordAuthor gate oxide damage -
dc.subject.keywordAuthor local Joule heat -
dc.subject.keywordAuthor low-frequency (LF) noise -
dc.subject.keywordAuthor trap recovery -
dc.subject.keywordPlus TRANSISTORS -

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