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Han, Ki Jin
Electromagnetic System Design Lab
Research Interests
  • Electromagnetics, electromechanics, electromagnetic compatibility (EMC)

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간접 접촉 프로빙 기법을 이용한 패키지 관통전극의 특성 추출

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Title
간접 접촉 프로빙 기법을 이용한 패키지 관통전극의 특성 추출
Author
정종우한기진
Issue Date
2016-05
Publisher
한국전자파학회
Citation
전자파기술, v.27, no.3, pp.37 - 43
URI
https://scholarworks.unist.ac.kr/handle/201301/20699
URL
http://www.dbpia.co.kr/Journal/ArticleDetail/NODE06748715
ISSN
1738-9712
Appears in Collections:
EE_Journal Papers
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