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3-D On-Chip Integration of GaN Power Devices on Power Delivery Network (PDN) With Direct Heat Spreading Layer Bonding for Heterogeneous 3-D (H3D) Stacked Systems File

Jeong, Jaeyong , Lee, Chan Jik , Choi, Sung Joon , Rheem, Nahyun , Song, Minseo , Suh, Yoon-Je , Kim, Bong Ho , Kim, Joon Pyo , Shim, Joonsup , Lee, Jiseon , et al

Article Issue Date2025-05 View0
A monolithic three-dimensional integrated red micro-LED display on silicon using AlInP/GaInP epilayers File

Park, Juhyuk , Baek, Woojin , Kim, Hyunsu , Jung, Dongsoon , Kim, Hokwon , Kim, Baul , Cho, Yong-Hoon , Lee, Jaebong , Lim, SungWook , Lee, Shin Hyung , et al

Article Issue Date2026-02 View1
A sub-micron-thick InGaAs broadband (400-1700 nm) photodetectors with a high external quantum efficiency (>70%) File File

Geum, Dae-Myeong , Lim, Jinha , Jang, Junho , Ahn, Seungyeop , Kim, SeongKwang , Shim, Joonsup , Kim, Bong Ho , Park, Juhyuk , Baek, Woo Jin , Jeong, Jaeyong , et al

Conference Paper Issue Date2022-06-12 View2
Cryogenic III-V and Nb electronics integrated on silicon for large-scale quantum computing platforms File

Jeong, Jaeyong , Kim, Seong Kwang , Suh, Yoon-Je , Lee, Jisung , Choi, Joonyoung , Kim, Joon Pyo , Kim, Bong Ho , Park, Juhyuk , Shim, Joonsup , Rheem, Nahyun , et al

Article Issue Date2024-12 View0
Fully CMOS-Compatible Room-Temperature Waveguide-Integrated Bolometer Based on Germanium-on-Insulator Platform at Mid-Infrared Operating Beyond 4 μm File

Shim, Joonsup , Lim, Jinha , Kim, Inki , Kim, Seong Kwang , Ahn, Seung-Yeop , Park, Juhyuk , Jeong, Jaeyong , Kim, Bong Ho , Lee, Seunghyeon , An, Jihwan , et al

Conference Paper Issue Date2023-12-09 View0
Heterogeneous and Monolithic 3D Integrated Full-Color Micro-Light-Emitting Diodes via CMOS-Compatible Oxide Bonding for μLEDoS File File

Kim, Hyun soo , Park, Juhyuk , Baek, Woo Jin , Geum, Dae-Myeong , Kim, Inki , Lim, Hyeongrak , Lim, Jinha , Kim, Seong Kwang , Jeong, Jaeyong , Shim, Joonsup , et al

Article Issue Date2025-08 View0
Highly Sensitive Free-Standing Waveguide-Integrated Bolometer on Germanium-on-Insulator Platform for Mid-Infrared On-Chip Spectroscopy File

Kim, Inki , Shim, Joonsup , Lim, Jinha , Jeong, Jaeyong , Kim, Bong Ho , Kim, Sanghyeon

Article Issue Date2025-05 View0
Highly-efficient (>70%) and Wide-spectral (400-1700 nm) sub-micron-thick InGaAs photodiodes for future high-resolution image sensors File File

Geum, Dae-Myeong , Lim, Jinha , Jang, Junho , Ahn, Seungyeop , Kim, Seongkwang , Shim, Joonsup , Kim, Bong Ho , Park, Juhyuk , Baek, Woo Jin , Jeong, Jaeyong , et al

Article Issue Date2024-11 View0
Role of Inter-Layer Dielectric on the Electrical and Heat Dissipation Characteristics in the Heterogeneous 3D Sequential CFETs with Ge p-FETs on Si n-FETs File

Kim, Seong Kwang , Lim, Hyeong-Rak , Shim, Joonsup , Baek, Woojin , Kim, Seongho , Park, Youngkeun , Jeong, Jaejoong , Lim, Jinha , Kim, Joon Pyo , Jeong, Jaeyong , et al

Conference Paper Issue Date2023-12-09 View0
Room-temperature waveguide-integrated photodetector using bolometric effect for mid-infrared spectroscopy applications File File

Shim, Joonsup , Lim, Jinha , Kim, Inki , Jeong, Jaeyong , Kim, Bong Ho , Kim, Seong Kwang , Geum, Dae-Myeong , Kim, Sanghyeon

Article Issue Date2025-03 View0
Thermal Studies of 3-D Stacked InGaAs HEMTs and Mitigation Strategy of Self-Heating Effect Using Buried Metal Insertion File

Jeong, Jaeyong , Kim, Seong Kwang , Suh, Yoon-Je , Shim, Joonsup , Beak, Woo Jin , Choi, Sung Joon , Kim, Joon Pyo , Kim, Bong Ho , Geum, Dae-Myeong , Kim, Jongmin , et al

Article Issue Date2024-08 View0
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