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Innovative NIPAM-Based PSAs for Carbon-Neutral Electronic Waste Management

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2024-10-18 View78
N-isopropyl acrylamide based thermo-responsive pressure-sensitive adhesive for eco-friendly waste management

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-05-11 View56
Replacing Traditional Adhesives with Thermo-Switchable Adhesive for Eco-Friendly Recycling

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-10-12 View69
Temperature-Responsive Adhesives Based on N-isopropyl acrylamide

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-11-09 View76
Temperature-Responsive Adhesives for Sustainable Electronics Disassembly

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak-Sun , Park, Keum Hwan , Lee, Dong Woog

Conference Paper Issue Date2024-04-04 View68
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