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Accelerated Stress Testing Methodology to Risk Assess Silicon-Package Thermo-Mechanical Failure Modes Resulting from Moisture Exposure under Use Conditions File

Rangaraj, Sudarshan , Kwon, Daeil , Pei, Min , Hicks, Jeffrey , Leatherman, G , Lucero, Alan , Wilson, Terri , Streit, Sarah , He, Jun

Conference Paper Issue Date2013-04-14 View31
Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data File

Kwon, Daeil , Pei, Min , Han, Ru , Lucero, Alan , Vasudevan, Vasu , Kwasnick, Robert , Polasam, Praveen S

Conference Paper Issue Date2013-05-28 View31
FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach File

Kwon, Daeil , Han, Ru , Pei, Min , Lucero, Alan , Ge, Yun , Harries, Richard , Zheng, Tieyu

Conference Paper Issue Date2013-05-28 View25
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