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Atomic Layer Deposited Highly Conductive Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Park, Young-Bae , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-03 View28
Development of highly conductive NbCx thin films using PEALD for diffusion barrier applications in Cu and Ru interconnects

Park, Chaehyun , Hong, Tae Eun , Kim, Sang Bok , Bae, Jong-Seong , Kweon, Minjeong , Kim, Soo-Hyun

Conference Paper Issue Date2024-11-20 View60
Highly conductive niobium carbide thin films prepared by plasma enhanced atomic layer deposition as diffusion barriers for Cu and Ru interconnects

Park, Chaehyun , Kweon, Minjeong , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2024-06-24 View60
Highly Conductive Ultrathin Niobium Carbide Thin Films as Next-Generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma-Enhanced Atomic Layer Deposition File

Park, Chaehyun , Kweon, Minjeong , Mohapatra, Debananda , Cheon, Taehoon , Bae, Jong-Seong , Jeong, Daeyoon , Jang, Hyunwoo , Shim, Seungwon , Park, Young-Bae , Kang, Youngho , et al

Article Issue Date2025-07 View84
Plasma-Enhanced Atomic Layer Deposition of High-Quality InN Thin Films Using a Novel In Precursor and NH3 Plasma

Kim, Yejun , Kweon, Minjeong , Park, Chaehyun , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-24 View12
Plasma-enhanced atomic layer deposition of niobium carbide using a new Nb precursor and H2 Plasma and its application to diffusion barrier for Cu and Ru interconnects

Park, Chaehyun , Kim, Sang Bok , Kweon, Minjeong , Kim, Soo-Hyun

Conference Paper Issue Date2024-08-06 View48
Plasma-Enhanced Atomic Layer Deposition of Yttrium Carbide Thin Films as a Promising Transition Metal Carbide for Dual Diffusion Barrier in Cu and Ru Metallization File

Kweon, Minjeong , Park, Chaehyun , Mohapatra, Debananda , Kim, Sang Bok , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-04 View13
Yttrium carbide thin film as an emerging transition metal carbide Prepared by plasma-enhanced atomic layer deposition for Dual diffusion barrier applications into Cu and Ru metallization File

Kweon, Minjeong , Park, Chaehyun , Mohapatra, Debananda , Kim, Sang Bok , Bae, Jong-Seong , Cheon, Taehoon , Kim, Soo-Hyun

Article Issue Date2025-08 View138
Zirconium Carbide (ZrCx) Thin Films as Next-generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma Enhanced Atomic Layer Deposition

Kweon, Minjeong , Park, Chaehyun , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-24 View12
Zirconium Carbide (ZrCx) Thin Films Prepared by Plasma-Enhanced Atomic Layer Deposition as a diffusion barrier for Ru & Cu metallization

Kweon, Minjeong , Park, Chaehyun , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2024-10-19 View65
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