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김수현

Kim, Soo-Hyun
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Zirconium Carbide (ZrCx) Thin Films as Next-generation Diffusion Barriers for Cu and Ru Interconnects Prepared by Plasma Enhanced Atomic Layer Deposition

Author(s)
Kweon, MinjeongPark, ChaehyunKim, Sang BokKim, Soo-Hyun
Issued Date
2025-06-24
URI
https://scholarworks.unist.ac.kr/handle/201301/89450
Citation
AVS 25th International Conference on Atomic Layer Deposition & the 12th International Atomic Layer Etching Workshop (ALD/ALE 2025)
Publisher
AVS (American Vacuum Society)

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