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Showing results 1 to 12 of 12

Issue DateTitleAuthor(s)TypeView
2017-08-30A preliminary analysis of domain coupling in package power distribution networkBae, Byoungjin; Kim, Seungwon; Kim, Youngmin; Kang, Seokhyeong; Kim, Il Joon; Kim, Kwangseok; Kang, Sunwon; Han, Ki JinCONFERENCE52
2015-10-05An optimal operating point by using error monitoring circuits with an error-resilient techniqueLee, Jaemin; Kim, Seungwon; Kim, Youngmin; Kang, SeokhyeongCONFERENCE45
2017-09Analysis and reduction of the voltage noise of multi-layer 3D IC with multi-paired power delivery networkKim, Seungwon; Kim, YoungminARTICLE316
2014-11-05Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV modelsKim, Seungwon; Han, Ki Jin; Kang, Seokhyeong; Kim, YoungminCONFERENCE38
2014-02Analysis of power integrity of multi-layer 3D IC with PEEC-based PDNHan, Ki Jin; Kim, Seungwon; Kim, YoungminCONFERENCE34
2018-03-19Fast chip-package-PCB coanalysis methodology for power integrity of multi-domain high-speed memory: A case studyKim, Seungwon; Han, Ki Jin; Kim, Youngmin; Kang, SeokhyeongCONFERENCE49
2017-06-20Fast Predictive Useful Skew Methodology for Timing-Driven Placement OptimizationKim, Seungwon; Do, SangGi; Kang, SeokhyeongCONFERENCE72
2017-11-13GRASP based metaheuristics for layout pattern classificationWoo, Mingyu; Kim, Seungwon; Kang, SeokhyeongCONFERENCE45
2015-12-15Identification of Parameter Domain for the Design of High-Speed I/O InterfaceKim, Seungwon; Kim, Youngmin; Han, Ki JinCONFERENCE47
2015-03-04Novel Adaptive Power Gating Strategy of TSV-based Multi-layer 3D ICKim, Seungwon; Kang, Seokhyeong; Han, Ki Jin; Kim, YoungminCONFERENCE36
2019-08Optimal Power Delivery Strategy in Modern VLSI DesignKim, Kyung Rok; Kim, SeungwonDoctoral thesis207
2019-03-25Power Delivery Pathfinding for Emerging Die-to-Wafer Integration TechnologyKahng, Andrew B.; Kang, Seokhyeong; Kim, Seungwon; Samadi, Kambiz; Xu, BangqiCONFERENCE36
Showing results 1 to 12 of 12