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Enhanced functional properties of ABC-type atomic layer deposited Ru thin films for advanced Cu alternative nanoscale interconnects File File

Kim, Jeongha , Mohapatra, Debananda , Son, Yeseul , Jang, Jae Min , Kim, Sang Bok , Hong, Tae Eun , Cheon, Taehoon , Shong, Bonggeun , Kim, Soo-Hyun

Article Issue Date2026-03 View9
Improved performance of atomic layer deposited Ru thin film prepared by 6-step ALD process as a Cu alternative interconnect

Kim, Jeongha , Kim, Sang Bok , Cheon, Taehoon , Son, Yeseul , Kim, Soo-Hyun

Conference Paper Issue Date2024-06-24 View99
Improved properties of atomic layer deposited Ru films by providing additional reactant for Cu alternative interconnects

Kim, Jeongha , Son, Yeseul , Cheon, Taehoon , Kim, Sang Bok , Kim, Soo-Hyun

Conference Paper Issue Date2024-08-06 View73
Improved Properties of Atomic Layer Deposited Ru Films by Providing Additional Reactant for Cu Alternative Nanoscale Interconnects File

Kim, Jeongha , Mohapatra, Debananda , Son, Yeseul , Jang, Jae Min , Kim, Sang Bok , Cheon, Taehoon , Shong, Boggeun , Kim, Soo-Hyun

Conference Paper Issue Date2025-06-04 View20
Impurity Reduction Leading to Enhanced Properties in Atomic Layer Deposited Ru Films by Introducing Additional Reactant for Cu Alternative Interconnects

Son, Yeseul , Hong, Tae Eun , Kim, Sang Bok , Bae, Jong-Seong , Kim, Jeongha , Kim, Soo-Hyun

Conference Paper Issue Date2024-11-20 View64
Low-Resistivity Ru Thin Films Grown by a 6-step Atomic Layer Deposition Process for Cu Alternative Interconnects File

Kim, Jeongha

Thesis Issue Date2025-08 View49
Small and Simple Molecular Structure Based Thermally Stable Ruthenium Precursor in Advancing Ruthenium ALD Process for Scaled Interconnect Metallization File File

Nakatsubo, Hideaki , Mohapatra, Debananda , Lee, Eun-soo , Kim, Jeongha , Cho, Iaan , Iseki, Masato , Shigetomi, Toshiyuki , Harada, Ryosuke , Na, Sang-woong , Cheon, Taehoon , et al

Article Issue Date2026-02 View27
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