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High-frequency testing of vertical interconnection array using indirect contact probing method with an improved calibration File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2016-11 View143
Indirect Contact Probing Method for Characterizing Vertical Interconnections in Electronic Packaging File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Article Issue Date2015-01 View102
Indirect contact probing method for characterizing via arrays in electonic packaging File

Kim, Jingook , Jeong, JongWoo , Han, Ki Jin , Kang, No-Weon

Conference Paper Issue Date2014-12-15 View71
Indirect Contact Probing Method for Characterizing Via Arrays in Electronic Packaging File

Han, Ki Jin , Jeong, JongWoo , Kim, Jingook , Kang, No-Weon

Conference Paper Issue Date2014-12-15 View77
Multi-Port Characterization of Vias Using Indirect Contact Probing Method File

Jeong, Jongwoo , Kim, Jingook , Kang, No-Weon , Han, Ki Jin

Conference Paper Issue Date2015-05-26 View69
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