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Showing results 6 to 7 of 7

Issue DateTitleAuthor(s)TypeView
2003-12Stress-strain curves of flip-chip solder balls based on finite-element modeling of thermal displacements measured by electronic speckle pattern interferometryLee, BW; Kim, Ju-Young; Kwon, DARTICLE542
2004-07Synthesis and lithographic evaluation of poly[(methacrylic acid tert-butyl cholate ester)-co-(γ-butyrolactone-2-yl methacrylate)]Kim, JB; Ko, JS; Choi, JH; Jang, Ji-Hyun; Oh, TH; Kim, HW; Lee, BWARTICLE617
Showing results 6 to 7 of 7

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