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Showing results 40 to 59 of 103

Failure Prediction of MLCCs using Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-11-11 View8

Failure Prediction of Multilayer Ceramic Capacitors (MLCCs) under Temperature-Humidity-Bias Testing Conditions Using Non-Linear Modeling File File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2013-09 View15

FEA Modeling and Solder Fatigue Model for New Physical Damage Based UC to TC Requirement Approach File

Kwon, Daeil , Han, Ru , Pei, Min , Lucero, Alan , Ge, Yun , Harries, Richard , Zheng, Tieyu

Conference Paper Issue Date2013-05-28 View7

Hygroscopic Swelling Behavior of 3D Printed Parts due to Changes in Environmental Conditions File

Park, Ju-young , Ha, Sangho , Park, Eunju , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-21 View9

HYGROSCOPIC SWELLING BEHAVIOR OF 3D PRINTED PARTS DUE TO CHANGES IN ENVIRONMENTAL CONDITIONS File

Park, Juyoung , Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-08-23 View11

Hygroscopic swelling behavior of Nylon 12 parts produced via selective laser sintering process

Ha, Sangho , Park, Eunjoo , Kwon, Daeil , Kim, Namhun

Conference Paper Issue Date2016-10-10 View10

Identification of Interconnect Failure Mechanisms Using RF Impedance Analysis File

Kwon, Daeil , None

Conference Paper Issue Date2009-51-02 View13

Improved Reliability Prediction Methodology for Electronic Packages Using RF Impedance Analysis

Kwon, Daeil

Conference Paper Issue Date2013 View3

Industry 4.0: A Special Section in IEEE Access File File

Su, Shun-Feng , Rudas, Imre J. , Zurada, Jacek M. , Er, Meng Joo , Chou, Jyh-Horng , Kwon, Daeil

Article Issue Date2017-07 View11

Interconnect Failure Detection using Digital Signal Characteristics of Electronics

이진우 , 권대일

Conference Paper Issue Date2016-04-07 View6

IoT-Based Prognostics and Systems Health Management for Industrial Applications File File

Kwon, Daeil , Hodkiewicz, Melinda , Fan, Jiajie , Shibutani, Tadahiro , Pecht, Michael G.

Article Issue Date2016-07 View16

Knowledge Based Risk Assessment for Electronic Products and Systems Based on Probabilistic Use Condition

Kwon, Daeil

Conference Paper Issue Date2014-04-03 View8

Life Test Planning for Improved Reliability Prediction under Limited Time-to-Failure Data

Kwon, Daeil

Conference Paper Issue Date2015-10-23 View10

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian tracking approaches

Shin, Insun , Kwon, Daeil

Conference Paper Issue Date2017-07-12 View11

Lifetime Prediction of Optocouplers in Digital Input and Output Modules based on Bayesian Tracking Approaches File

Shin, Insun , Kwon, Daeil

Article Issue Date2018-08 View5

Managerial and Industrial Information Prognosis: from Business Decision Making to Asset Management

Kwon, Daeil , Shin, Jiseon

Conference Paper Issue Date2018-08-06 View6

Non-Destructive Wire Fault Diagnosis Using Resistance Spectroscopy Analysis

Park, Eunjoo , Kwon, Daeil

Conference Paper Issue Date2018-08-21 View12

Nondestructive Sensing of Interconnect Failure Mechanisms Using Time-Domain Reflectometry File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2011-05 View16

Optimal Interval Censoring Design for Reliability Prediction of Electronic Packages File File

Kwon, Daeil , Shin, Insun

Article Issue Date2015-06 View9

Optimized Reliability Test Design to Reduce Uncertainties in Reliability Assessment File

Kwon, Daeil , None

Conference Paper Issue Date2012-05-29 View8

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