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Comparative Analysis of Interconnect Degradation using RF Impedance and Event Detectors

Kwon, Daeil , None

Conference Paper Issue Date2010-04-06 View8

Deep Neural Network for Fault Diagnosis of Power Transformers using Dissolved Gas Analysis

Kim, Sunuwe , Jang, Beomchan , Youn, Byeng D. , Kwon, Daeil , Park, Byeong-Cheol

Conference Paper Issue Date2017-07-14 View8

Defect state and severity analysis using discretized state vectors File

Baek, Soojung , Baek, Woonsang , Kwon, Daeil , Kim, Duck Young

Article Issue Date2018-06 View13

Define Electrical Packaging Temperature Cycling Requirement with Field Measured User Behavior Data File

Kwon, Daeil , Pei, Min , Han, Ru , Lucero, Alan , Vasudevan, Vasu , Kwasnick, Robert , Polasam, Praveen S

Conference Paper Issue Date2013-05-28 View4

Degradation of Digital Signal Characteristics due to Intermediate Stages of Interconnect Failure File

Kwon, Daeil , Azarian, M.H. , Pecht, M.

Conference Paper Issue Date2010-05-09 View12

Detection of Failure Precursors in Multilayer Ceramic Capacitors Based on Symbolic Time Series Analysis File

Park, Juyoung , Kwon, Daeil

Article Issue Date2016-01 View8

Detection of MLCC failure precursors based on Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-10-15 View9

Detection of Solder Joint Degradation Using RF Impedance Analysis File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-27 View10

Detection of Solder Joint Failure Precursors on Tin-Lead and Lead-Free Assemblies Using RF Impedance Analysis File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Conference Paper Issue Date2009-05-26 View6

Development of a Non-Invasive On-Chip Interconnect Health Sensing Method Based on Bit Error Rates File File

Shin, Insun , Koo, Kyoungmin , Kwon, Daeil

Article Issue Date2018-10 View24

Development of Accelerated Life Test for Modules of Semiconductor Equipment

박주영 , 신인선 , 권대일

Conference Paper Issue Date2016-04-28 View7

Early Degradation Detection of the Insulation Resistance of MLCCs by the Pattern Analysis of Capacitance and Dissipation Signals

Baek, Soojeong , Kwon, Daeil , Kim, Duck Young

Conference Paper Issue Date2017-10-18 View13

Early Degradation Detection of the Insulation Resistance of Multi-Layer Ceramic Capacitors by the Pattern Analysis of Capacitance and Dissipation Signals File

Baek, Sujeong , Kwon, Daeil , Kim, Duck Young

Article Issue Date2018-09 View15

Early Detection of Interconnect Degradation by Continuous Monitoring of RF Impedance File

Kwon, Daeil , Azarian, Michael H. , Pecht, Michael

Article Issue Date2009-06 View15

Early detection of interconnect degradation using RF impedance and SPRT File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-10-06 View17

Early identification of emerging technologies: A machine learning approach using multiple patent indicators File

Lee, Changyong , Kwon, Ohjin , Kim, Myeongjung , Kwon, Daeil

Article Issue Date2018-02 View13

Effect of humidity changes on dimensional stability of 3D printed parts by selective laser sintering File

Kwon, Daeil , Park, Eunju , Ha, Sangho , Kim, Namhun

Article Issue Date2017-09 View9

Effect of Solder Joint Degradation on RF Impedance File

Kwon, Daeil , Azarian, M.H. , Pecht, M.G.

Conference Paper Issue Date2008-05-12 View12

Effect of Uncertain Material Properties on Fan-Out Wafer Level Packaging using Finite Element Analysis

Kim, Geumtaek , Kwon, Daeil

Conference Paper Issue Date2018-10-26 View11

Failure Prediction of MLCCs using Symbolic Time Series Analysis

Park, Juyoung , Kwon, Daeil

Conference Paper Issue Date2015-11-11 View8

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