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Showing results 1 to 8 of 8

Architecture, Chip, and Package Codesign Flow for Interposer-Based 2.5-D Chiplet Integration Enabling Heterogeneous IP Reuse File

Kim, Jinwoo , Murali, Gauthaman , Park, Heechun , Qin, Eric , Kwon, Hyoukjun , Chekuri, Venkata Chaitanya Krishna , Rahman, Nael Mizanur , Dasari, Nihar , Singh, Arvind , Lee, Minah , et al

Article Issue Date2020-11 View12
Chip-Level RAID with Flexible Stripe Size and Parity Placementfor Enhanced SSD Reliability File

Kim, Jaeho , Lee, Eunjae , Choi, Jongmoo , Lee, Donghee , Noh, Sam H.

Article Issue Date2016-04 View5
Ge(2)Sb(2)Te(5) confined structures and integration of 64Mb phase-change random access memory File

Yeung, Fai , Ahn, Su-Jin , Hwang, Young-Nam , Jeong, Changwook , Song, Yoon-Jong , Lee, Su-Youn , Lee, Se-Ho , Ryoo, Kyung-Chang , Park, Jae-Hyun , Shin, Jae-Min , et al

Article Issue Date2005-04 View7
Highly Elastic and Conductive Metallic Interconnect with Crystalline-Amorphous Nanolaminate File

Hwang, Gyeong-Seok , Bae, Jae-Young , Kim, Joon-Woo , Park, Sun-Young , Kim, Jeonghyun , Kang, Seung-Kyun , Kim, Ju-Young

Article Issue Date2023-03 View9
Highly reliable ring-type contact for high-density phase change memory File

Jeong, Changwook , Ahn, Su-Jin , Hwang, Young-Nam , Song, Yoon-Jong , Oh, Jac-Hee , Lee, Su-Youn , Lee, Se-Ho , Ryoo, Kyung-Chang , Park, Jong-Hyun , Park, Jae-Hyun , et al

Article Issue Date2006-04 View8
Highly Strained Si pFinFET on SiC With Good Control of Sub-Fin Leakage and Self-Heating File

Shin, Donggwan , Jeong, Changwook , Jeon, Jongwook , Chung, Ilsub

Article Issue Date2014-12 View4
IoT-Based Prognostics and Systems Health Management for Industrial Applications File File

Kwon, Daeil , Hodkiewicz, Melinda , Fan, Jiajie , Shibutani, Tadahiro , Pecht, Michael G.

Article Issue Date2016-07 View6
ROUTING PROTOCOL WITH SCALABILITY, ENERGY EFFICIENCY AND RELIABILITY IN WSN File

Sim, Inbo , Lee, Jaiyong

Article Issue Date2010-07 View5
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