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정창욱

Jeong, Changwook
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Highly reliable ring-type contact for high-density phase change memory

Author(s)
Jeong, ChangwookAhn, Su-JinHwang, Young-NamSong, Yoon-JongOh, Jac-HeeLee, Su-YounLee, Se-HoRyoo, Kyung-ChangPark, Jong-HyunPark, Jae-HyunShin, Jac-MinYeung, FaiJeong, Won-CheolKim, Jeong-InKoh, Gwan-HyeobJeong, Gi-TaeJeong, Hong-SikKim, Kinam
Issued Date
2006-04
DOI
10.1143/JJAP.45.3233
URI
https://scholarworks.unist.ac.kr/handle/201301/27157
Fulltext
https://iopscience.iop.org/article/10.1143/JJAP.45.3233
Citation
JAPANESE JOURNAL OF APPLIED PHYSICS, v.45, no.4B, pp.3233 - 3237
Abstract
An advanced bottom electrode contact (BEC) was successfully developed for reliable high-density 256Mb phase-change random access memory (PRAM) using a ring-type contact scheme. This advanced ring-type BEC was prepared by depositing very thin TiN films inside a contact hole, after which core dielectrics were uniformly filled into the TiN-deposited contact hole. Using this novel contact scheme, it was possible to reduce reset current while maintaining a low set resistance and a uniform cell distribution. Thus, it has been clearly demonstrated that the use of the ring-type contact technology is very feasible for high-density PRAM beyond 256 Mb.
Publisher
IOP PUBLISHING LTD
ISSN
0021-4922
Keyword (Author)
low reset currentreliability256 Mb PRAMring-shape contact

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