사진

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Shin, Tae Joo (신태주)

Department
Central Research Facility(연구지원본부)
Research Interests
Synchrotron Radiation Application Researches
Lab
UNIST Central Research Facilities (UCRF)
Website
http://ucrf.unist.ac.kr/
This table browses all dspace content
Issue DateTitleAuthor(s)TypeViewAltmetrics
2001-04Residual stress behavior in methylsilsesquioxane-based dielectric thin filmsOh, W; Shin, Tae Joo; Ree, M, et alARTICLE415 Residual stress behavior in methylsilsesquioxane-based dielectric thin films
2001-04FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborneYu, Jinshu; Zhou, D; Cai, W, et alARTICLE372 FT-IR spectroscopic and residual stress studies on curing of epoxy resin waterborne
2001-02Fully rod-like aromatic polyimides: Structure, properties, and chemical modificationsRee, M; Shin, Tae Joo; Lee, SWARTICLE365
2000-07Copolymerization of carbon dioxide and propylene oxide using various zinc glutarate derivatives as catalystsRee, M; Bae, JY; Jung, JH, et alARTICLE458 Copolymerization of carbon dioxide and propylene oxide using various zinc glutarate derivatives as catalysts
2000-06Structure and properties of various poly(amic diisopropyl ester-alt-imide)s and their alternating copolyimidesKim, SI; Shin, Tae Joo; Ree, M, et alARTICLE420 Structure and properties of various poly(amic diisopropyl ester-alt-imide)s and their alternating copolyimides
2000-03Self-adhesion of poly(4,4 '-oxydiphenylene biphenyltetracarboximide) and its adhesion to substratesRee, M; Park, YH; Shin, Tae Joo, et alARTICLE421 Self-adhesion of poly(4,4 '-oxydiphenylene biphenyltetracarboximide) and its adhesion to substrates
2000-03Adhesion of poly(4,4 '-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor originYu, J; Ree, M; Shin, Tae Joo, et alARTICLE509 Adhesion of poly(4,4 '-oxydiphenylene pyromellitimide) to copper metal using a polymeric primer: Effects of miscibility and polyimide precursor origin
2000-01Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper jointsYu, J; Ree, M; Shin, Tae Joo, et alARTICLE477 Miscibility behavior of polyimide (PI)/poly(arylene ether benzimidazole) (PAEBI) blends and its effects on the adhesion of PI/PAEBI/copper joints

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