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dc.citation.endPage 813 -
dc.citation.number 2 -
dc.citation.startPage 807 -
dc.citation.title IEEE TRANSACTIONS ON ELECTRON DEVICES -
dc.citation.volume 73 -
dc.contributor.author Kim, Bong Ho -
dc.contributor.author Kim, Seong Kwang -
dc.contributor.author Kuk, Song-Hyeon -
dc.contributor.author Jeong, Jaeyong -
dc.contributor.author Park, Youngkeun -
dc.contributor.author Suh, Yoon-Je -
dc.contributor.author Kim, Joon Pyo -
dc.contributor.author Lee, Chan Jik -
dc.contributor.author Geum, Dae-Myeong -
dc.contributor.author Cho, Byung Jin -
dc.contributor.author Kim, Sang Hyeon -
dc.date.accessioned 2026-03-26T10:41:56Z -
dc.date.available 2026-03-26T10:41:56Z -
dc.date.created 2026-03-24 -
dc.date.issued 2026-02 -
dc.description.abstract This work investigates the recovery operation and interfacial layer (IL) scavenging to improve the performance and reliability of HfZrOx-based ferroelectric field-effect transistors (FeFETs). A systematic electrical characterization demonstrated that IL scavenging reduces the operating voltage and initial interface traps while mitigating interface trap generation and ferroelectric fatigue induced by stress cycling, thereby improving memory window (MW) recovery capability. In addition, by investigating the frequency of recovery pulses under iso-time conditions, we found that lower frequencies are favorable for complete MW recovery. Our findings offer a valuable understanding of the degradation and recovery mechanisms in FeFETs, underscoring the critical role of recovery speed and controlled IL. -
dc.identifier.bibliographicCitation IEEE TRANSACTIONS ON ELECTRON DEVICES, v.73, no.2, pp.807 - 813 -
dc.identifier.doi 10.1109/TED.2025.3643407 -
dc.identifier.issn 0018-9383 -
dc.identifier.scopusid 2-s2.0-105026373450 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/90844 -
dc.identifier.url https://ieeexplore.ieee.org/abstract/document/11317773 -
dc.identifier.wosid 001676268600046 -
dc.language 영어 -
dc.publisher IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC -
dc.title Recovery Operation in HfZrOx-Based FeFETs With Interfacial Layer Scavenging -
dc.type Article -
dc.description.isOpenAccess FALSE -
dc.relation.journalWebOfScienceCategory Engineering, Electrical & Electronic; Physics, Applied -
dc.relation.journalResearchArea Engineering; Physics -
dc.type.docType Article -
dc.description.journalRegisteredClass scie -
dc.description.journalRegisteredClass scopus -
dc.subject.keywordAuthor FeFETs -
dc.subject.keywordAuthor Stress -
dc.subject.keywordAuthor Logic gates -
dc.subject.keywordAuthor Fatigue -
dc.subject.keywordAuthor Degradation -
dc.subject.keywordAuthor Voltage -
dc.subject.keywordAuthor Electrons -
dc.subject.keywordAuthor Electrodes -
dc.subject.keywordAuthor Transistors -
dc.subject.keywordAuthor Switches -
dc.subject.keywordAuthor Ferroelectric field-effect transistor (FeFET) -
dc.subject.keywordAuthor interfacial layer (IL) -
dc.subject.keywordAuthor oxygen scavenging -
dc.subject.keywordAuthor recovery operation -

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