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김주영

Kim, Ju-Young
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Measurement of dielectric bonding adhesion energy with machine compliance correction by DCB test

Author(s)
김동현곽지윤심영주김수정김인주이시예김성동Kim, Ju-Young
Issued Date
2025-11-06
URI
https://scholarworks.unist.ac.kr/handle/201301/89526
Citation
2025 ISMP
Publisher
ISMP

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