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Low-Resistivity Ru Thin Films Grown by a 6-step Atomic Layer Deposition Process for Cu Alternative Interconnects
- Author(s)
- Kim, Jeongha
- Advisor
- Kim, Soo-Hyun
- Issued Date
- 2025-08
- URI
- https://scholarworks.unist.ac.kr/handle/201301/88168 http://unist.dcollection.net/common/orgView/200000903429
- Publisher
- Ulsan National Institute of Science and Technology
- Degree
- Master
- Major
- Graduate School of Semiconductor Materials and Devices Engineering
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