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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | Kim, Soo-Hyun | - |
| dc.contributor.author | Kim, Jeongha | - |
| dc.date.accessioned | 2025-09-29T11:30:37Z | - |
| dc.date.available | 2025-09-29T11:30:37Z | - |
| dc.date.issued | 2025-08 | - |
| dc.description.degree | Master | - |
| dc.description | Graduate School of Semiconductor Materials and Devices Engineering | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/88168 | - |
| dc.identifier.uri | http://unist.dcollection.net/common/orgView/200000903429 | - |
| dc.language | ENG | - |
| dc.publisher | Ulsan National Institute of Science and Technology | - |
| dc.rights.embargoReleaseDate | 9999-12-31 | - |
| dc.rights.embargoReleaseTerms | 9999-12-31 | - |
| dc.subject | Ruthenium, ALD, Interconnect, 6-step Ru ALD | - |
| dc.title | Low-Resistivity Ru Thin Films Grown by a 6-step Atomic Layer Deposition Process for Cu Alternative Interconnects | - |
| dc.type | Thesis | - |
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