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A Parametric Study on Interfacial Bond Strength in Cu/SiCN Hybrid Bonding: A Multiscale Approach
- Author(s)
- Jang, Minki
- Advisor
- Chung, Hayoung
- Issued Date
- 2025-08
- URI
- https://scholarworks.unist.ac.kr/handle/201301/88147 http://unist.dcollection.net/common/orgView/200000904348
- Publisher
- Ulsan National Institute of Science and Technology
- Degree
- Master
- Major
- Department of Mechanical Engineering
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