Hydrogels have emerged as promising materials for flexible and wearable devices due to their mechanical softness and biocompatibility. However, conventional hydrogels often fail to combine multiple essential functions, such as reusable dry adhesion, strong wet adhesion, and electrical conductivity. Here, we present a multifunctional hydrogel patch that integrates polyethylene glycol dimethacrylate (PEGDMA) with poly(3,4-ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). The hydrogel features bioinspired mushroom-shaped micropillars that adapt to target surfaces. This design achieves exceptional adhesion strength on both dry (129.2 kPa) and wet surfaces (116.3 kPa), maintaining its performance through 300 cycles. By incorporating PEDOT:PSS into the PEGDMA network, we significantly enhance the electrical conductivity, enabling effective Joule heating. The micropillar architecture ensures uniform contact with various surfaces, leading to efficient heat transfer. This hydrogel patch represents a significant step forward in flexible and wearable technologies by combining mechanical flexibility, electrical and thermal conductivity, and robust, reversible adhesion in a single material.