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Jeong, Hoon Eui
Multiscale Biomimetics and Manufacturing Lab.
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Smart Mechanical Structures and Design for Advanced Adhesives: A Review

Author(s)
Kim, JaeilChoi, GeonjunPark, SeongjinKim, MinwookKim, KwangjunJung, Ho-SupKwak, Moon KyuOk, Jong G.Jeong, Hoon Eui
Issued Date
2025-03
DOI
10.1007/s12541-025-01211-y
URI
https://scholarworks.unist.ac.kr/handle/201301/86146
Citation
INTERNATIONAL JOURNAL OF PRECISION ENGINEERING AND MANUFACTURING, v.26, pp.757 - 772
Abstract
Smart adhesives with engineered mechanical structures have emerged as a transformative technology with broad applications in fields such as wearable healthcare devices, bioengineering, and soft robotics. By integrating advanced mechanical architectures like kirigami, tessellations, and multilayered designs, these adhesives exhibit enhanced surface and mechanical properties that lead to superior interfacial adhesion. Such designs offer critical advantages-improved stretchability, substrate conformability, and increased adhesion strength-over conventional adhesives. This review explores the range of engineered structures used in smart adhesives and demonstrates how these innovations address the limitations of traditional adhesives. Additionally, we discuss their applications in wearable healthcare devices, flexible electronics, and robotics.
Publisher
KOREAN SOC PRECISION ENG
ISSN
2234-7593
Keyword (Author)
Smart adhesiveEngineered mechanical structureKirigamiTessellationMultilayer adhesive
Keyword
SHAPESTRATEGIES

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