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김수현

Kim, Soo-Hyun
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Improved properties of atomic layer deposited Ru films by providing additional reactant for Cu alternative interconnects

Author(s)
Kim, JeonghaSon, YeseulCheon, TaehoonKim, Sang BokKim, Soo-Hyun
Issued Date
2024-08-06
URI
https://scholarworks.unist.ac.kr/handle/201301/85581
Citation
AVS 24th International Conference on Atomic Layer Deposition
Publisher
AVS

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