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- Kim, Soo-Hyun
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | FI | - |
| dc.citation.conferencePlace | Messukeskus in Helsinki | - |
| dc.citation.title | AVS 24th International Conference on Atomic Layer Deposition | - |
| dc.contributor.author | Kim, Jeongha | - |
| dc.contributor.author | Son, Yeseul | - |
| dc.contributor.author | Cheon, Taehoon | - |
| dc.contributor.author | Kim, Sang Bok | - |
| dc.contributor.author | Kim, Soo-Hyun | - |
| dc.date.accessioned | 2025-01-03T17:35:06Z | - |
| dc.date.available | 2025-01-03T17:35:06Z | - |
| dc.date.created | 2025-01-03 | - |
| dc.date.issued | 2024-08-06 | - |
| dc.identifier.bibliographicCitation | AVS 24th International Conference on Atomic Layer Deposition | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/85581 | - |
| dc.language | 영어 | - |
| dc.publisher | AVS | - |
| dc.title | Improved properties of atomic layer deposited Ru films by providing additional reactant for Cu alternative interconnects | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2024-08-04 | - |
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