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- Park, Heechun
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| DC Field | Value | Language |
|---|---|---|
| dc.citation.conferencePlace | CH | - |
| dc.citation.title | IEEE/IEIE International Conference on Electronics, Information, and Communication | - |
| dc.contributor.author | Park, Sojung | - |
| dc.contributor.author | Park , Heechun | - |
| dc.date.accessioned | 2024-03-14T10:35:07Z | - |
| dc.date.available | 2024-03-14T10:35:07Z | - |
| dc.date.created | 2024-03-14 | - |
| dc.date.issued | 2024-01-28 | - |
| dc.identifier.bibliographicCitation | IEEE/IEIE International Conference on Electronics, Information, and Communication | - |
| dc.identifier.uri | https://scholarworks.unist.ac.kr/handle/201301/81629 | - |
| dc.publisher | IEEE | - |
| dc.title | Timing-Aware Tier Partitioning for 3D ICs With Critical Path Consideration | - |
| dc.type | Conference Paper | - |
| dc.date.conferenceDate | 2024-01-28 | - |
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