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Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Laboratory (IC & EMC Lab)
Research Interests
  • Convergence between circuit and EM domains

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Modeling and measurement of simultaneous switching noise coupling through signal via transition

Cited 47 times inthomson ciCited 51 times inthomson ci
Title
Modeling and measurement of simultaneous switching noise coupling through signal via transition
Author
Park, JongbaeKim, HyungsooJeong, YouchulKim, JingookPak, Jun SoKam, Dong GunKim, Joungho
Keywords
Noise coupling; Power/ground noise; Printed circuit board (PCB); Reference plane change; Simultaneous switching noise (SSN); System-on-package (SoP); Via
Issue Date
2006-08
Publisher
Institute of Electrical and Electronics Engineers
Citation
IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.29, no.3, pp.548 - 559
Abstract
The signal via is a heavily utilized interconnection structure in high-density System-on-Package (SoP) substrates and printed circuit boards (PCBs). Vias facilitate complicated routings in these multilayer structures. Significant simultaneous switching noise (SSN) coupling occurs through the signal via transition when the signal via suffers return current interruption caused by reference plane exchange. The coupled SSN decreases noise and timing margins of digital and analog circuits, resulting in reduction of achievable jitter performance, bit error ratio (BER), and system reliability. We introduce a modeling method to estimate SSN coupling based on a balanced transmission line matrix (TLM) method. The proposed modeling method is successfully verified by a series of time-domain and frequency-domain measurements of several via transition structures. First, it is clearly verified that SSN coupling causes considerable clock waveform distortion, increases jitter and noise, and reduces margins in pseudorandom bit sequence (PRBS) eye patterns. We also note that the major frequency spectrum component of the coupled noise is one of the plane pair resonance frequencies in the PCB power/ground pair. Furthermore, we demonstrate that the amount of SSN noise coupling is strongly dependent not only on the position of the signal via, but also on the layer configuration of the multilayer PCB. Finally, we have successfully proposed and confirmed a design methodology to minimize the SSN coupling based on an optimal via positioning approach.
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DOI
10.1109/TADVP.2006.872996
ISSN
1521-3323
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EE_Journal Papers
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