dc.citation.endPage |
1170 |
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dc.citation.number |
8 |
- |
dc.citation.startPage |
1166 |
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dc.citation.title |
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS |
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dc.citation.volume |
17 |
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dc.contributor.author |
Kim, Youngmin |
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dc.contributor.author |
Petranovic, D. |
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dc.contributor.author |
Sylvester, D. |
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dc.date.accessioned |
2023-12-22T07:42:08Z |
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dc.date.available |
2023-12-22T07:42:08Z |
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dc.date.created |
2014-10-28 |
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dc.date.issued |
2009-08 |
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dc.description.abstract |
In this paper, we analyze and model the impact of floating dummy fill on the signal capacitance considering various parameters including signal dimensions, dummy shape and dimensions. Intra-layer dummy has its greatest impact on coupling capacitance while inter-layer dummy has larger impact on the ground capacitance component. Based on this analysis, we propose simple capacitance models (Cc for intra-layer dummy and Cg for inter-layer dummy). To consider realistic cases with both signals and metal fill in adjacent layers, we apply a weighting function approach to the Cg model. We verify this model using benchmark circuits and find that total net capacitance with floating fill can be extracted within similar to 1% of field solver results on average with total extraction runtime reductions of up to 40%. When evaluating the incremental capacitance due to fill alone, average error of the models range from 2%-15% across benchmarks and fill-related runtime overhead is reduced by 60%-88%. |
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dc.identifier.bibliographicCitation |
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS, v.17, no.8, pp.1166 - 1170 |
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dc.identifier.doi |
10.1109/TVLSI.2009.2020392 |
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dc.identifier.issn |
1063-8210 |
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dc.identifier.scopusid |
2-s2.0-68549115189 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/7849 |
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dc.identifier.url |
http://www.scopus.com/inward/record.url?partnerID=HzOxMe3b&scp=68549115189 |
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dc.identifier.wosid |
000268282700020 |
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dc.language |
영어 |
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dc.publisher |
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC |
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dc.title |
Simple and Accurate Models for Capacitance Considering Floating Metal Fill Insertion |
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dc.type |
Article |
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dc.description.journalRegisteredClass |
scie |
- |
dc.description.journalRegisteredClass |
scopus |
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