File Download
There are no files associated with this item.
SFX Link
- Find it @ UNIST can give you direct access to the published full text of this article. (UNISTARs only)
- Kim, Ju-Young
Views & Downloads
Detailed Information
Cited time in 
Cited time in 
Cited time in
Metadata Downloads
반도체 패키지 공정용 구리박막의 기계적 물성 평가 및 향상을 위한 연구
- Issued Date
- 2020-12-04
- Citation
- 2020 한국생산제조학회 추계학술대회
- Publisher
- 한국생산제조학회
Items in Repository are protected by copyright, with all rights reserved, unless otherwise indicated.