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Park, Jang-Ung
Flexible Nano-electronics & Biotechnology Lab
Research Interests
  • Wireless wearable electronics, flexible electronics, printed electronics, nano-bio interfaces

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Collapse of stamps for soft lithography due to interfacial adhesion

Cited 54 times inthomson ciCited 61 times inthomson ci
Title
Collapse of stamps for soft lithography due to interfacial adhesion
Author
Hsia, KJHuang, YMenard, EPark, Jang-UngZhou, WRogers, JFulton, JM
Keywords
Interfacial adhesion energy; Mechanical collapse; Soft lithography; Stamps
Issue Date
2005-04
Publisher
AMER INST PHYSICS
Citation
APPLIED PHYSICS LETTERS, v.86, no.15, pp.1 - 3
Abstract
Collapse of elastomeric elements used for pattern transfer in soft lithography is studied through experimental measurements and theoretical modehng. The objective is to identify the driving force for such collapse. Two potential driving forces, the self-weight of the stamp and the interfacial adhesion, are investigated. An idealized configuration of periodic rectangular grooves and flat punches is considered. Experimental observations demonstrate that groove collapse occurs regardless of whether the gravitational force promotes or suppresses such collapse, indicating that self-weight is not the driving force. On the other hand, model predictions based on the postulation that interfacial adhesion is the driving force exhibit excellent agreement with the experimentally measured collapse behavior. The interfacial adhesion energy is also evaluated by matching an adhesion parameter in the model with the experimental data.
URI
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DOI
10.1063/1.1900303
ISSN
0003-6951
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MSE_Journal Papers
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