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- Jeong, Hoon Eui
- Multiscale Biomimetics and Manufacturing Lab.
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전기장을 이용하여 탈부착이 가능한 건식 접착 구조물
- Application Date
- 2019-06-19
- Registration Date
- 2020-06-09
- Application No.
- 10-2019-0072979
- Publication No.
- 10-2122776
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