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- Kim, Ju-Young
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반도체 패키징 구리 재배선층의 신뢰성 평가
- Author(s)
- Kwak, J.-Y, Chery, Emmanuel, Bertheau, Julien, Slabbekoorn, John, Messemaeker, Joke De, Beyne, Eric, Kim, Ju-Young
- Issued Date
- 2023-11-30
- Citation
- 2023 한국기계가공학회 추계학술대회
- Publisher
- 한국기계가공학회
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