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김주영

Kim, Ju-Young
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반도체 소자에서 구리 범프와 절연 고분자의 하이브리드 본딩

Author(s)
심영주김한글황경석Kim, Ju-Young
Issued Date
2023-02-14
URI
https://scholarworks.unist.ac.kr/handle/201301/67235
Citation
제 30회 한국반도체학술대회
Publisher
한국반도체학회

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