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- Kim, Ju-Young
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반도체 3차원 패키징 공정에서 구리범프와 절연 고분자의 하이브리드 본딩
- Author(s)
- 심영주, 김한글, 황경석, Kim, Ju-Young
- Issued Date
- 2023-04-26
- Citation
- 2023 대한금속재료학회 춘계학술대회
- Publisher
- 대한금속재료학회
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