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김정환

Kim, Junghwan
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High-Performance Indium Gallium Tin Oxide Transistors with an Al2O3 Gate Insulator Deposited by Atomic Layer Deposition at a Low Temperature of 150 degrees C: Roles of Hydrogen and Excess Oxygen in the Al2O3 Dielectric Film

Author(s)
Choi, Cheol HeeKim, TaikyuUeda, ShigenoriShiah, Yu-ShienHosono, HideoKim, JunghwanJeong, Jae Kyeong
Issued Date
2021-06
DOI
10.1021/acsami.1c04210
URI
https://scholarworks.unist.ac.kr/handle/201301/62072
Citation
ACS APPLIED MATERIALS & INTERFACES, v.13, no.24, pp.28451 - 28461
Abstract
In this work, high-performance amorphous In0.75Ga0.23Sn0.02O (a-IGTO) transistors with an atomic layer-deposited Al2O3 dielectric layer were fabricated at a maximum processing temperature of 150 degrees C. Hydrogen (H) and excess oxygen (O-i) in the Al2O3 film, which was controlled by adjusting the oxygen radical density (P-O2: flow rate of O-2/[Ar+O-2]) in the radio-frequency (rf) plasma during ALD growth of Al2O3, significantly affected the performance and stability of the resulting IGTO transistors. The concentrations of H and O-i in Al2O3/IGTO stacks according to P-O2 were characterized by secondary ion mass spectroscopy, X-ray photoelectron spectroscopy, hard X-ray photoemission spectroscopy, and thermal desorption spectroscopy. The high concentration of H at a low P-O2 of 2.5% caused heavy electron doping in the underlying IGTO during thermal annealing at 150 degrees C, leading to a conductive behavior in the resulting transistor without modulation capability. In contrast, a high PO2 condition of 20% introduced O-2 molecules (or O-i) into the Al2O3 film, which negatively impacted the carrier mobility and caused anomalous photo-bias instability in the IGTO transistor. Through in-depth understanding of how to manipulate H and O-i in Al2O3 by controlling the Po, we fabricated high-performance IGTO transistors with a high field-effect mobility 040 of 58.8 cm(2)/Vs, subthreshold gate swing (SS) of 0.12 V/decade, threshold voltage (V-TH) of 0.5 V, and ION/OFF ratio of -109 even at the maximum processing temperature of 150 degrees C. Simultaneously, the optimized devices were resistant to exposure to external positive gate bias stress (PBS) and negative bias stress (NBS) for 3600 s, where the V-TH shifts for exposure to PBS and NBS for this duration were 0.1 V and -0.15 V, respectively.
Publisher
AMER CHEMICAL SOC
ISSN
1944-8244
Keyword (Author)
alumina (Al2O3)plasma-enhanced atomic layer deposition (PEALD)indium gallium tin oxide (IGTO)thin film transistor (TFT)oxygen interstitiallow temperature
Keyword
DOPED IN2O3TRANSPARENTFABRICATIONMECHANISMS

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