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Lee, Jiseok
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Thermal and Mechanical Properties of the Cu-Graphite Composites with Spatial Anisotropy

Author(s)
Ryu, Geon HongSon, ChangilSuhling, Jeffrey C.Lee, JiseokPark, SanghaByun, Myunghwan
Issued Date
2023-02
DOI
10.3365/KJMM.2023.61.2.120
URI
https://scholarworks.unist.ac.kr/handle/201301/60872
Fulltext
http://kjmm.org/journal/view.php?doi=10.3365/KJMM.2023.61.2.120
Citation
KOREAN JOURNAL OF METALS AND MATERIALS, v.61, no.2, pp.120 - 125
Abstract
In the present study, we analyzed the thermal and mechanical properties of Cu-graphitecomposites (CGCs) with spatially anisotropic graphite layers. These composites were fabricated using acombination of electroless plating and spark plasma sintering (SPS) processes. Thermal conductivities andthermal expansion coefficients of the composites were measured using differential thermal analysis (DTA) anda laser flash method. In particular, the thermal expansion coefficients of the composites were investigated bycomparative analysis, which was conducted by processing prototypes in a vertical direction with a parallelsector in the direction of the upper and lower axial pressure. The Cu reinforced with the graphite flake showedbetter thermal properties compared to the graphite fiber, while the graphite fiber led to better mechanicalproperties. This investigation was conducted to better understand the dependence of thermal properties onthe morphologies of the graphite layers (i.e., flake and fiber types) in the Cu matrix. The bending strengthand friction coefficient of the composites were also investigated. Taken together, the results from this workoffer fruitful, yet practical information to utilize the CGCs as a thermal management material, essential forelectric and electronic devices.
Publisher
대한금속·재료학회
ISSN
1738-8228
Keyword (Author)
Cu-graphite compositespatial anisotropythermal and mechanical propertiesspark plasma sintering
Keyword
ELECTROCHEMICAL DEPOSITIONCOPPERCONDUCTIVITYFABRICATION

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