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정창욱

Jeong, Changwook
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Highly reliable 50nm contact cell technology for 256Mb PRAM

Author(s)
Ahn, S.J.Hwang, Y.N.Song, Y.J.Lee, S.H.Lee, S.Y.Park, J.H.Jeong, ChangwookRyoo, K.C.Shin, J.M.Fai, Y.Oh, J.H.Koh, G.H.Jeong, G.T.Joo, S.H.Choi, S.H.Son, Y.H.Shin, J.C.Kim, Y.T.Jeong, H.S.Kim, K.
Issued Date
2005-06-14
DOI
10.1109/.2005.1469227
URI
https://scholarworks.unist.ac.kr/handle/201301/58537
Citation
2005 Symposium on VLSI Technology, pp.98 - 99
Abstract
Novel small contact fabrication technologies were proposed to realize reliable high density 256Mb PRAM(Phase Change Memory) product. Introducing the 2-step CMP (Chemical Mechanical Polishing) process and the ring-shaped contact structure, the contact area distribution was greatly improved even at the smallest contact diameter of 50nm node. The validity of this approach was directly confirmed by the evaluation of the functionality for the fabricated 256Mbit PRAM based on 0. 10μm CMOS technology.
Publisher
2005 Symposium on VLSI Technology
ISSN
0743-1562

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