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실리콘 봉지재의 굴절률 차이를 이용한 LED 패키지 제작 및 성능 평가에 관한 연구

Author(s)
Park, Lee Soon, 곽성권, 유태욱
Issued Date
2011-05-13
URI
https://scholarworks.unist.ac.kr/handle/201301/43617
Citation
2011 춘계 공업화학회
Publisher
한국공업화학회

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