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Browsing "Department of Electrical Engineering" by Author : Lim, Daegyun

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Ambient air-operated thermo-switchable adhesion of N-isopropylacrylamide-incorporated pressure sensitive adhesives File

Hwang, Jeonguk , Lim, Daegyun , Lee, Geonwoo , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, KeumHwan , Ku, Kang Hee , Lee, Dong Woog

Article Issue Date2023-06 View32
Carboxyethyl acrylate incorporated optically clear adhesives with outstanding adhesion strength and immediate strain recoverability for stretchable electronics File

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Baig, Chunggi , Lee, Dong Woog

Article Issue Date2022-06 View17
Development of elastic pressure sensitive adhesives for flexible electronics

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Lee, Dong Woog

Conference Paper Issue Date2021-04-23 View8
N-isopropyl acrylamide based thermo-responsive pressure-sensitive adhesive for eco-friendly waste management

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-05-11 View5
Replacing Traditional Adhesives with Thermo-Switchable Adhesive for Eco-Friendly Recycling

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-10-12 View7
Stretchable pressure sensitive adhesives with high adhesive performance and optically clearance for flexible electronics

Lim, Daegyun , Baek, Myung-Jin , Kim, Hak Sun , Baig, Chunggi , Lee, Dong Woog

Conference Paper Issue Date2021-11-05 View7
Temperature-Responsive Adhesives Based on N-isopropyl acrylamide

Lee, Geonwoo , Hwang, Jeonguk , Lim, Daegyun , Kim, Young Eun , Park, Jintae , Baek, Myung-Jin , Kim, Hak Sun , Park, Keum Hwan , Ku, Kang Hee , Lee, Dong Woog

Conference Paper Issue Date2023-11-09 View6
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