A wireless electronic skin (e-skin) sensor system embedding a multi-functional sensor device, a dual-mode readout integrated circuit (ROIC), and mobile monitoring interface is presented. Depending on measured e-skin characteristics, the ROIC is designed to support dual-mode signal interfaces of a tactile sensing process (T-SP) for low external pressure less than 1kPa and a general pressure sensing process (GP-SP) for higher pressure and also skin temperature. Its prototype chip including a Δ-Σ ADC is fabricated in a 0.18 m CMOS process.