11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002, pp.275 - 278
Abstract
We propose new slot shapes to reduce crosstalk, reflection, and radiated emission from the slotted reference plane in multi-layer PCBs or packages. The reduction is successfully demonstrated by the simulations and the measurements.
Publisher
11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002