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김진국

Kim, Jingook
Integrated Circuit and Electromagnetic Compatibility Lab.
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dc.citation.conferencePlace US -
dc.citation.conferencePlace Hyatt Regency MontereyMonterey -
dc.citation.endPage 278 -
dc.citation.startPage 275 -
dc.citation.title 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 -
dc.contributor.author Kim, Jingook -
dc.contributor.author Kim, Hyungsoo -
dc.contributor.author Jeong, Youchul -
dc.contributor.author Kim, Joungho -
dc.date.accessioned 2023-12-20T06:08:04Z -
dc.date.available 2023-12-20T06:08:04Z -
dc.date.created 2013-07-17 -
dc.date.issued 2002-10-21 -
dc.description.abstract We propose new slot shapes to reduce crosstalk, reflection, and radiated emission from the slotted reference plane in multi-layer PCBs or packages. The reduction is successfully demonstrated by the simulations and the measurements. -
dc.identifier.bibliographicCitation 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002, pp.275 - 278 -
dc.identifier.doi 10.1109/EPEP.2002.1057931 -
dc.identifier.scopusid 2-s2.0-28444460077 -
dc.identifier.uri https://scholarworks.unist.ac.kr/handle/201301/35845 -
dc.identifier.url https://ieeexplore.ieee.org/document/1057931 -
dc.language 영어 -
dc.publisher 11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 -
dc.title Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission -
dc.type Conference Paper -
dc.date.conferenceDate 2002-10-21 -

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