dc.citation.conferencePlace |
US |
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dc.citation.conferencePlace |
Hyatt Regency MontereyMonterey |
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dc.citation.endPage |
278 |
- |
dc.citation.startPage |
275 |
- |
dc.citation.title |
11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 |
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dc.contributor.author |
Kim, Jingook |
- |
dc.contributor.author |
Kim, Hyungsoo |
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dc.contributor.author |
Jeong, Youchul |
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dc.contributor.author |
Kim, Joungho |
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dc.date.accessioned |
2023-12-20T06:08:04Z |
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dc.date.available |
2023-12-20T06:08:04Z |
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dc.date.created |
2013-07-17 |
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dc.date.issued |
2002-10-21 |
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dc.description.abstract |
We propose new slot shapes to reduce crosstalk, reflection, and radiated emission from the slotted reference plane in multi-layer PCBs or packages. The reduction is successfully demonstrated by the simulations and the measurements. |
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dc.identifier.bibliographicCitation |
11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002, pp.275 - 278 |
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dc.identifier.doi |
10.1109/EPEP.2002.1057931 |
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dc.identifier.scopusid |
2-s2.0-28444460077 |
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dc.identifier.uri |
https://scholarworks.unist.ac.kr/handle/201301/35845 |
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dc.identifier.url |
https://ieeexplore.ieee.org/document/1057931 |
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dc.language |
영어 |
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dc.publisher |
11th Topical Meeting on Electrical Performance of Electronic Packaging, EPEP 2002 |
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dc.title |
Tapered slot shape on slotted reference plane of multi-layer PCB for reduction of crosstalk and radiated emission |
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dc.type |
Conference Paper |
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dc.date.conferenceDate |
2002-10-21 |
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